Standard inspection field
MH500
- PCB range
- 250 × 350 mm
- Camera
- 12 MP
- Published field / resolution
- 250 × 350 mm / 85 µm
- Machine dimensions
- 773 × 902 × 1422 mm
- Approximate mass
- 150 kg
SMT equipment sourcing · inspection · packing · global delivery
Inline insertion inspection before wave soldering. Compare the standard and wider inspection-field versions below; the camera and cabinet dimensions differ.
Inline insertion inspection before wave soldering. Select by the actual board envelope, optical configuration and installation space—not the suffix alone.
Standard inspection field
Wider inspection field
Translated from the manufacturer brochure, pages 2, 3, 4, 5, 6. Figures describe standard model configurations, not stock or an offered unit. Dimensions are listed in the source order and exclude the tower light where stated. Brochure family illustration; the W version has a different footprint and camera, compared explicitly below. Request nameplate, configuration and board-trial evidence before selection.
| PCB thickness | 0.5–6 mm |
|---|---|
| Rated power | 0.5 kVA |
| Inspection role | Missing / reversed / skewed inserted components; barcode and marking review where configured |
| PCB range | 250 × 350 mm |
| Camera | 12 MP |
| Published field / resolution | 250 × 350 mm / 85 µm |
| Machine dimensions | 773 × 902 × 1422 mm |
| Approximate mass | 150 kg |

Board capacity, camera, lighting, cabinet size and power follow the selected version. Ask for a nameplate, configuration list and sample-board inspection result; a shared brochure photograph is not proof of an individual machine.
MH500 is the smaller-format member of its family, with a 250 × 350 mm documented board field for targeted component and marking checks.
Shared brochure software illustrations, not proof of installed options. The selected model uses optical images; these diagrams do not imply 3D height measurement.

The brochure describes deep learning, data optimization and one-click recognition of trained components and solder joints. This section is presented as a programming and review concept, not as a claim that every defect can be recognised without application-specific training.
The buyer should verify the available software version, library, training workflow and false-call review process.

The source examples depict wrong component, reversed component, lifted component, silkscreen issue, standing component, missing component, offset, lifted lead, solder bridging, virtual soldering and solder bead conditions.
Use these examples to start a defect-library discussion; the final programmed coverage depends on the component package, solder finish, board design, image quality and acceptance criteria.
Minghao MH500 selection should begin with production requirements and evidence, not with a model name alone.
Minghao MH500 should be evaluated against the buyer’s board dimensions, defect classes, inspection program, changeover profile and required line integration. The final application fit depends on the evidence for the specific unit.
These questions keep the quotation scope connected to the buyer’s real SMT process.
Minghao MH500 buyers should confirm this with actual-machine evidence before quotation.
Minghao MH500 buyers should confirm this with actual-machine evidence before quotation.
Minghao MH500 buyers should confirm this with actual-machine evidence before quotation.
Before a purchase decision, request a dated power-on and representative operating cycle for the actual unit, including relevant transport, motion, inspection and visible-condition evidence.
Request a unit-specific Minghao MH500 list for cameras, light sources, conveyor belts, sensors, filters and recommended maintenance items. Availability is not claimed on this review page.
Provide PCB dimensions, inspection stage, throughput target, calibration evidence, voltage, destination, required accessories and desired inspection evidence for the proposed Minghao MH500.
Automated optical inspection evaluates visible assembly features. Solder paste inspection addresses deposits before placement, while X-ray inspection can address hidden joints. Compare inspection methods by the defect and process stage; one method does not establish all three capabilities.
Trial known-good and known-defect assemblies with the offered camera, lighting and software. Review repeatability, false calls, review workflow, board transfer and program recovery instead of relying on an image-resolution label alone.
For Minghao MH500, use the page’s PCB thickness, Rated power, Inspection role entries as quotation checkpoints. Request evidence for the offered serial; published model data and reference images do not establish its installed options or stock.
AOI & SPI inspection · How Should Buyers Test Dual-lane AOI with Mixed Boards?
Common questions for overseas buyers evaluating a Minghao MH500.
It translates the user-supplied Minghao PDF and keeps its published configuration information separate from a machine-specific quotation.
No. Board design, program criteria, defect library, lighting configuration and calibration must be validated against the intended process.
No. It is a model guide page only; availability, condition, options and delivery require confirmation.
The V3 scrolling proof gallery is retained. It describes LCSMT export preparation, not the condition of a particular Minghao MH500 unit.






Share PCB size, defect classes, required throughput, inspection program, voltage, destination and inspection expectations. LCSMT can review whether an actual Minghao MH500 configuration is a practical match.