Top-view component and joint AOI
TR7700Q SII
- Resolution
- 9.8 / 10 / 12 / 15 µm factory configurations
- Board
- Standard up to 510 × 460 mm
SMT equipment sourcing · inspection · packing · global delivery
The TR7700Q comparison places Q SII, QC SII, QH SII, QB SII, QM SII and QE in one decision guide. Choose by inspection role: QB is bottom-view and QM targets packaging. The separate top-and-bottom TB system is outside this combined page.
3D optical inspection of components and solder joints, with separate bottom-view and semiconductor-focused choices. Select by the actual board envelope, optical configuration and installation space—not the suffix alone.
Top-view component and joint AOI
Top-view essential inspection
Ultra-high-speed top-view AOI
Bottom-view THT/DIP inspection
Semiconductor and packaging inspection
2D + 3D reference version pictured
Based on the individually named manufacturer product pages. Figures describe standard model configurations, not stock or an offered unit. Dimensions are listed in the source order and exclude the tower light where stated. TR7700QE is the user-selected representative image; it does not depict every SII configuration. Request nameplate, configuration and board-trial evidence before selection.
| Q / qc sii | Top-view 3D inspection; up to 57 cm²/s at the specified 15 µm condition |
|---|---|
| Qh sii | Up to 80 cm²/s at the stated 21 MP / 15 µm condition |
| Qb sii | Bottom-view THT/DIP inspection; 15 µm, up to 57 cm²/s |
| Qm sii | Semiconductor/packaging inspection; 5.5 µm and up to 7.7 cm²/s |
| Qe | 12 MP, 10/15 µm factory settings; optional Z control required for the 40 mm range |
| Photo scope | The user-selected TR7700QE image is a representative family illustration, not an exact photo of each SII variant |

The TRI TR7700Q Family offer must document Exact suffix, inspection side, camera/resolution, Z control and conveyor configuration; Gauge repeatability, known-defect coverage, false-call review and interface/license scope.
TRI TR7700Q Family selection should begin with production requirements and evidence, not with a model name alone.
The TR7700Q family comparison starts with inspection side and feature size. A QB bottom-view through-hole job is not interchangeable with a top-view Q SII assembly or a fine-feature QM packaging job. Match the defect set and component geometry to the recorded variant before considering its published imaging speed.
For a TR7700Q offer, request a challenge-board run covering accepted joints, missing parts and the difficult defects. Review repeatability and false calls under the proposed resolution. Catalogue rates depend on imaging conditions and component distribution; record those settings when comparing cycle results.
3D optical inspection of components and solder joints, with separate bottom-view and semiconductor-focused choices. Choose by inspection role: QB is bottom-view and QM targets packaging. The separate top-and-bottom TB system is outside this combined page.
These questions keep the quotation scope connected to the buyer’s real SMT process.
TRI TR7700Q Family buyers should confirm this with actual-machine evidence before quotation.
TRI TR7700Q Family buyers should confirm this with actual-machine evidence before quotation.
TRI TR7700Q Family buyers should confirm this with actual-machine evidence before quotation.
Before shipment, review the relevant power-on, movement, operating state and visible condition for the specific offered unit.
Request a dated operating sequence for the offered TRI TR7700Q Family. The preview is a model illustration; the orange control requests evidence, not playback.
Request a unit-specific TRI TR7700Q Family list for camera/projector service parts, conveyor components, calibration targets and compatible computer hardware. Availability is not claimed on this review page.
Provide target assembly, process requirements, q / qc sii, installed configuration and destination, required accessories and desired inspection evidence for the proposed TRI TR7700Q Family.
Common questions for overseas buyers evaluating a TRI TR7700Q Family.
3D optical inspection of components and solder joints, with separate bottom-view and semiconductor-focused choices. Choose by inspection role: QB is bottom-view and QM targets packaging. The separate top-and-bottom TB system is outside this combined page.
Exact suffix, inspection side, camera/resolution, Z control and conveyor configuration. Request the exact nameplate and option list.
The TRI TR7700Q Family illustration is model-reference imagery, not a dated stock photograph. Serial, location, condition, price and running evidence require separate confirmation.
The V3 scrolling proof gallery is retained. It describes LCSMT export preparation, not the condition of a particular TRI TR7700Q Family unit.






Share target assembly, process requirements, q / qc sii, installed configuration and destination and inspection expectations. LCSMT can review whether an actual TRI TR7700Q Family configuration is a practical match.