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Model guide · unit evidence required
Overview

Yamaha YSP10 Solder Paste Printer

Yamaha YSP10 is a solder-paste printer designed around servo-controlled printing and automated changeover options. Yamaha now lists it as discontinued; this guide supports configuration-specific used-equipment enquiries, not a claim of new production or ready stock. Consider YSP10 for mixed-product printing where support setup, stencil exchange and cleaning influence downtime. Its discontinued status makes installed software, option identification and service support important purchase questions.

Official source recordedUnit evidence requiredInspection guideExport support
Manufacturer-published model data

Yamaha YSP10 Technical Specifications

Current published pcb envelope50 × 50 to 510 × 510 mm; 650 × 510 mm is an option in the current archived table
Printing head3S: Swing Single Squeegee; verify the head actually installed
Positioning repeatability6 sigma ±0.01 mm; not finished paste-deposit accuracy
Published printing cycle10 seconds without cleaning; 12 seconds including cleaning, under optimum manufacturer conditions
Stencil-frame maximum750 × 750 mm; confirm the required supported frame size
Current supply referenceSingle-phase AC 200–230 V ±20 V; air at least 0.4 MPa
Standard external dimensions1,640 × 1,840 × 1,525 mm excluding projections; approximately 1,700 kg
Manufacturer model data · Important: model-level figures and features are conditional manufacturer information, not guarantees for a particular used Yamaha YSP10 unit.
Key FeaturesReference configuration illustration for Yamaha YSP10

Configuration Must Be Verified

The offer must identify YSP10 nameplate, 3S head, support-pin mechanism, stencil-frame handling, conveyor extension, cleaning and fitted automation; Representative paste deposits measured by SPI, alignment repeatability, cleaning interval, supported-board transfer, actual changeover and recipe recovery.

Buyer decision guide

When Yamaha YSP10 Makes Sense — and When It May Not

Yamaha YSP10 selection should begin with production requirements and evidence, not with a model name alone.

Process and applicationSupport and align a PCB beneath the stencil, sweep solder paste through its apertures with the 3S head, separate the stencil and inspect the deposit. Board support, paste handling and cleaning must be qualified together on the actual assembly.
Configuration choicesThe 3S head controls squeegee attack angle, speed and applied force. Stencil suction and print-stability control address the printing process. Automatic push-up pin exchange, stencil replacement and solder transfer are optional functions in the 2019 launch; a YSP10 label does not establish that they are fitted.
Selection boundaryConsider YSP10 for mixed-product printing where support setup, stencil exchange and cleaning influence downtime. Its discontinued status makes installed software, option identification and service support important purchase questions.
Evidence to requestYSP10 nameplate, 3S head, support-pin mechanism, stencil-frame handling, conveyor extension, cleaning and fitted automation; Representative paste deposits measured by SPI, alignment repeatability, cleaning interval, supported-board transfer, actual changeover and recipe recovery. Model data does not establish the condition of an offered machine.
Application qualification

Yamaha YSP10 Acceptance Plan

Separate positioning from deposit quality

For a YSP10 enquiry, specify the PCB envelope, loaded underside geometry, stencil frame, paste system and the apertures that are difficult to print. The manufacturer positioning-repeatability number concerns alignment; it does not establish paste height, volume, shape or transfer efficiency. Request a representative supported-board print trial with independent solder-paste inspection and keep the stencil, paste, cleaning interval and settings alongside the measured results. Test the difficult assembly rather than accepting an empty transfer sequence as printing acceptance.

Verify each changeover option individually

Ask the seller to identify the support-pin exchange, stencil replacement and solder-transfer hardware on the offered serial. Yamaha introduced these as optional functions, not equipment guaranteed on every YSP10. Photograph the rear stencil handling arrangement and demonstrate a complete permitted changeover with the actual frame and board support. Include paste transfer, pin locations, safe recovery and the next job start in the evidence request. A reference illustration cannot establish licenses, option completeness or whether an unattended sequence is usable on your product.

Keep legacy and archived tables separate

The current archived Yamaha specification lists a 650 × 510 mm optional board envelope and a 0.4 MPa air reference. The 2019 launch lists 610 × 510 mm and 0.45 MPa instead. Do not combine those values or assume a legacy unit received a later configuration. Retain the offered serial manual and extension-conveyor evidence. Current standard dimensions exclude projections; automatic stencil replacement changes the published width to 1,990 mm and an extension changes length to 1,973 mm. Plan operating and service clearance separately from the cabinet footprint.

Request a complete cycle and recoverable machine

The ten- and twelve-second figures are optimum manufacturer printing cycles with different cleaning inclusion, not guaranteed factory throughput. Time loading, alignment, printing, separation, transfer and the agreed cleaning schedule on a real board. Inspect cleaning consumables and vacuum operation under an approved safe procedure, and record the controller, software, recipes and authorized backup process. CNSMT and Shenzhen Nels name YSP10 in complete-equipment catalogues, but neither was contacted. Ask for dated serial, location, condition, support and delivery-scope evidence before treating those enquiries as an available machine.

Typical Applications

Typical Applications for Yamaha YSP10

Yamaha YSP10 should be evaluated against the buyer’s support and align a pcb beneath the stencil, sweep solder paste through its apertures with the 3s head, separate the stencil and inspect the deposit. board support, paste handling and cleaning must be qualified together on the actual assembly. The final application fit depends on the evidence for the specific unit.

Before quotation

Three Yamaha YSP10 Buyer Questions

These questions keep the quotation scope connected to the buyer’s real SMT process.

1

Which current published pcb envelope requirement must the proposed Yamaha YSP10 demonstrate?

Yamaha YSP10 buyers should confirm this with actual-machine evidence before quotation.

2

What is included in this Yamaha YSP10 offer: ysp10 nameplate, 3s head, support-pin mechanism, stencil-frame handling, conveyor extension, cleaning and fitted automation?

Yamaha YSP10 buyers should confirm this with actual-machine evidence before quotation.

3

Can the Yamaha YSP10 acceptance run document representative paste deposits measured by spi, alignment repeatability, cleaning interval, supported-board transfer, actual changeover and recipe recovery?

Yamaha YSP10 buyers should confirm this with actual-machine evidence before quotation.

Running video confirmation

Yamaha YSP10 Running Video Review

Before shipment, review the relevant power-on, movement, operating state and visible condition for the specific offered unit.

Request a dated operating sequence of the offered Yamaha YSP10. The model-image control requests evidence, not playback of a recorded video.

  • Power-on and visible operating-state confirmation
  • Support and align a PCB beneath the stencil, sweep solder paste through its apertures with the 3S head, separate the stencil and inspect the deposit. Board support, paste handling and cleaning must be qualified together on the actual assembly.
  • Unit-specific condition evidence before export packing
Yamaha YSP10 complete-machine preview for running-evidence request
Used-machine inspection

Inspection and Export Preparation for an Actual Yamaha YSP10

  • Nameplate and configurationModel, serial, year, voltage and installed options.
  • Machine configurationMechanical, transport, sensing, camera, software and motion condition relevant to the quoted Yamaha YSP10.
  • Transport and softwareConveyor, sensors, program and line-interface evidence where applicable.
  • Running and packing proofPower-on evidence, visible operation and export packing records.
Spare Parts

Yamaha YSP10 Spare Parts Scope

Request a unit-specific Yamaha YSP10 list for serial-correct squeegee and cleaning consumables, board support pins, conveyor service items, alignment references and authorized control backups. Availability is not claimed on this review page.

Quotation checklist

Provide target assembly, process requirements, current published pcb envelope, installed configuration and destination, required accessories and desired inspection evidence for the proposed Yamaha YSP10.

FAQ

Common questions for overseas buyers evaluating a Yamaha YSP10.

01Application

Which production task suits Yamaha YSP10?

Support and align a PCB beneath the stencil, sweep solder paste through its apertures with the 3S head, separate the stencil and inspect the deposit. Board support, paste handling and cleaning must be qualified together on the actual assembly. Consider YSP10 for mixed-product printing where support setup, stencil exchange and cleaning influence downtime. Its discontinued status makes installed software, option identification and service support important purchase questions.

02Configuration

What should a buyer confirm for Yamaha YSP10?

YSP10 nameplate, 3S head, support-pin mechanism, stencil-frame handling, conveyor extension, cleaning and fitted automation. Request the exact nameplate and option list.

03Unit evidence

Does this Yamaha YSP10 illustration prove stock?

The Yamaha YSP10 illustration is model-reference imagery, not a dated stock photograph. Serial, location, condition, price and running evidence require separate confirmation.

Export packing proof

Export Packing and Container Loading

The V3 scrolling proof gallery is retained. It describes LCSMT export preparation, not the condition of a particular Yamaha YSP10 unit.

LCSMT machine protection before packing
Machine protection
LCSMT moisture-proof wrapping
Moisture protection
LCSMT container loading support
Container loading
LCSMT machine protection before packing
Machine protection
LCSMT moisture-proof wrapping
Moisture protection
LCSMT container loading support
Container loading

Send Your Yamaha YSP10 Production Requirement

Share target assembly, process requirements, current published pcb envelope, installed configuration and destination and inspection expectations. LCSMT can review whether an actual Yamaha YSP10 configuration is a practical match.